WD4000 Wafer Geometry and Topography Measurement Equipment

CHOTEST Instrument WD4000 Wafer Geometry and Dimension Measurement Equipment reconstructs the three-dimensional topography of wafers through non-contact measurement. Its powerful measurement and analysis software stably calculates wafer thickness, TTV, BOW, WARP, and effectively prevents scratches and defects on wafers while enabling efficient measurement. It employs high-precision spectral confocal sensing technology and optical interference bidirectional scanning technology to complete non-contact scanning and create 3D mapping, achieving parameters such as wafer thickness, TTV, LTV, BOW, WARP, TIR, SORI, and others that reflect surface topography.

WD4000 Wafer Geometry and Dimension Measurement Equipment can measure wafers of different materials including gallium arsenide, gallium nitride, gallium phosphide, germanium, indium phosphide, lithium niobate, sapphire, silicon, silicon carbide, and glass.

Measurement Functions

1. Thickness measurement module: thickness, TTV (Total Thickness Variation), LTV, BOW, WARP, TIR, SORI, flatness, etc.;

2. Microscopic topography measurement module: roughness, flatness, micro-geometric profile, area, volume, etc.

3. Provides data processing functions including four major modules: position adjustment, correction, filtering, and extraction. Position adjustment includes functions such as image leveling and mirroring; correction includes spatial filtering, retouching, spike denoising, etc.; filtering includes form removal, standard filtering, frequency spectrum filtering, etc.; extraction includes area extraction and profile extraction.

4. Provides five major analysis functions: geometric profile analysis, roughness analysis, structure analysis, frequency analysis, and functional analysis. Geometric profile analysis includes feature measurements such as step height, distance, angle, curvature, and form and position tolerance evaluations like straightness and roundness; roughness analysis includes full parameters of line roughness per ISO4287, areal roughness per ISO25178, and flatness per ISO12781; structure analysis includes pore volume and troughs.

WD4000 wafer measurement equipment is widely used in substrate manufacturing, wafer manufacturing, packaging process inspection, 3C electronic glass screens and their precision components, optical processing, display panels, MEMS devices, and other ultra-precision machining industries. It can measure various surfaces from smooth to rough, low reflectivity to high reflectivity, and parameters such as thickness, roughness, flatness, micro-geometric profile, and curvature of workpieces from nanometer to micrometer levels.

Product Advantages

1. Non-contact thickness and three-dimensional Wiener topography integrated measurement

Integrates thickness measurement module and three-dimensional topography and roughness measurement module, allowing one machine to complete measurements of thickness, TTV, LTV, BOW, WARP, roughness, and three-dimensional topography.

2. High-precision thickness measurement technology

(1) Uses high-resolution spectral confocal transmission technology for efficient scanning of wafers.

(2) Equipped with a multi-degree-of-freedom electrostatic discharge coating vacuum chuck, supporting wafer sizes up to 12 inches.

(3) Employs Mapping following technology, enabling programmable automatic measurements including multiple points, lines, and surfaces.

3. High-precision three-dimensional topography measurement technology

(1) Uses optical white light interference technology, precision Z-direction scanning module, and high-precision 3D reconstruction algorithm, with Z-direction resolution up to 0.1 nm;

(2) Vibration isolation design reduces ground vibration and air acoustic wave vibration noise, achieving high measurement repeatability.

(3) Machine vision technology detects image Mark points, and virtual fixtures align samples, enabling automated continuous measurement of multiple points of topography.

4. Large-stroke high-speed gantry structure platform

(1) Large-stroke gantry structure (400x400x75 mm), with moving speed of 500 mm/s.

(2) High-precision granite base and beam, ensuring overall structural stability and reliability.

(3) Key motion mechanisms use high-precision linear guide rails and AC servo direct drive motors, paired with a grating system with 0.1 μm resolution, ensuring high precision and efficiency of the equipment.

5. Simple operation, easy and worry-free

(1) Integrated joystick with XYZ three-direction displacement adjustment function, allowing quick completion of pre-measurement preparations such as stage translation and Z-direction focusing.

(2) Dual anti-collision design avoids damage to the objective lens and the measured object due to misoperation.

(3) Electric objective lens switching function, making observation fast and simple.

Application Scenarios

1. Measurement of thickness and warpage of unpatterned wafers

WD4000 Wafer Geometry and Dimension Measurement Equipment reconstructs the three-dimensional topography of the upper and lower surfaces of wafers through non-contact measurement. Its powerful measurement and analysis software stably calculates wafer thickness, roughness, total thickness variation (TTV), effectively protecting the integrity of wafers with films or patterns.

2. Roughness measurement of unpatterned wafers

3D images of silicon wafer surfaces after coarse and fine grinding in the wafer thinning process, using surface roughness Sa values and the stability of multiple measurements to feedback processing quality. For thinned silicon wafers measured in the strong noise environment of the production workshop, the roughness of fine-ground silicon wafers is concentrated around 5 nm, with a repeatability of 0.046987 nm calculated from 25 measurements, indicating good measurement stability.

Partial Technical Specifications

Please note: Due to market development and product development needs, the content in this product documentation may be updated or modified at any time according to actual circumstances without prior notice. We appreciate your understanding for any inconvenience caused.